【最終】AR2018
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18LINTEC ANNUAL REPORT 2018Lamination of surface protective tapeBack grinding (wafer thinning)Lamination of dicing tapeRemoval of surface protective tapeDicing (wafer cutting)ReverseReverseThe manufacture of semiconductors involves the formation of a number of electronic circuits on the surface of a wafer sliced from columnar silicon ingot. The wafer is then ground on the backside to make it thinner and cut into individual chips, which are then mounted and stacked on a substrate. All of our semiconductor-related adhesive tapes and equipment are used in back-end processes after circuit formation.Back grindingThis is the process of using a grinding wheel to grind the back-side of the wafer to make it thinner. Tape is affixed to protect the circuit-carrying front from grinding water and dust.DicingDicing is the process of cutting the wafers into individual chips. Tape is placed on the backsides of wafers to fix them to a ring frame, thereby preventing chips from scattering during cutting.LINTEC’s semiconductor-related business began in 1986 with the development of a fixing tape for use in the wafer cutting process in the manufacture of semiconductors—a UV curable dicing tape. Such tapes adhere strongly to thin wafers, holding them firm when they are being diced into chips. Adhesion is then reduced through UV irradiation after dicing for easy removal when the chips are picked up. This tape radically changed the semiconductor industry. Since then, we have devel-oped many semiconductor-related tapes. We have also developed semiconductor-related equipment that fully leverages the special features of our tapes. In such ways, we have established our own unique position within the industry.LINTEC’s Semiconductor-Related Business SPECIAL FEATUREBack-endprocessTapes that protect the surface of wafer circuits and tape laminatorDicing tapes and wafer mounter that secure wafers to ring frames12Single crystal silicon ingotWaferSliceCircuit formationFront-end process

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