Adwill: Tape and equipment for semiconductor device production.

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BG Tape

Two types of back grinding tape are available: UV curable type, E series, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type, P series. The peeling tape, S series, is also available.

Dicing Tape

Two types of dicing tape are available: UV curable type, D series, which achieves easier pick-up after reducing adhesion by UV irradiation, and non-UV type, G series, which features outstanding long-term stability.

Dicing Die Bonding Tape

This tape has the functional combination of dicing tape and die-attach film. It solves problems such as bleeding of liquid adhesive. Products suitable for DBG(Dicing Before Grinding) process are also available.

Backside Coating Tape

LC Tape is a special adhesive tape that protects the die backside in Flip Chip mounting. While protecting and reinforcing the die backside, it also blocks light to minimize effects on circuit surfaces.

Label for Clean Room Use

This is a tracking label best suited for clean room use. The line-up also includes heatproof label material that features outstanding heat resistance, solvent resistance, and abrasion resistance properties.

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Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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