Adwill: Tape and equipment for semiconductor device production.

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BG Tape Laminator

This is an advanced back grinding tape laminator for thin wafers that achieves tension-free lamination. The line-up consists of two product types that vary in accordance with fully-automatic or semi-automatic functions.

BG Tape Remover

This is an advanced back grinding tape remover that peels tape with a minimal stress on wafer. The line-up consists of four product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.

Wafer Mounter

This is a high performance wafer mounter of high-throughput. The line-up consists of six product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.

UV Irradiation System

This is a high performance UV irradiation system with greater efficiency and uniformity. The line-up consists of four product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.

LC Tape Laminator

This is a laminator exclusively designed to optimize the lamination of LC Tape on 300mm wafers.

Pressurized Curing System

This is a heat and pressure curing system designed to eliminate fine air voids caused by die bonding with LE Tape onto uneven and narrow pitched substrates.

Barcode & Vision System

This is a fully-automatic barcode label printing and attachment system, which is used after wafer ID is recognized via the monitor.

Support Information

This is the support information on RAD series.

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Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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