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Compatible with Ultra-thin Wafer
A stand-alone system, and the ideal wafer multi-mounting system for ultra-thin wafer manufacture. From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine. |
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| 2. |
Wafer Handling Cycles Minimized
The handling frequency of wafer is reduced to 4 times in stand-alone, and reduced to 2 times in in-line system. As a result, the damage to wafer is suppressed to the utmost limit. |
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| 3. |
High Throughput
High throughput achieved by optimizing the transfer component.
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An increase in throughput of approximately 60% relative to RAD-2700F/12Sa (Throughput compared by the operation of φ300mm bare wafer. Actual throughput varies with lamination and peeling conditions). |
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| 4. |
Reduced Footprint
Extremely compact in design, the equipment measures 2,165mm(W) x 3,090mm(D) x 1,800mm(H) (.not including the signal tower and protruding parts).
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Compact design reduces equipment footprint by approximately 30% relative to RAD-2700F/12Sa. |
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| 5. |
Dicing Tape Lamination using Batch Cut System (Optional)
Even if non pre-cut dicing tape is used, the optionally installed tape cutting mechanism with a unique batch cut system will not damage the ring frame as the tape cutting is conducted inside the equipment. |
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| 6. |
Heat Seal/Adhesion Peeling Tape Lamination
For back grinding tape removal, both heat seal format and adhesive tape format (optional) can be used together in accordance with the physical properties of the back grinding tape used. |
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| 7. |
Supports DBG Process
In addition to regular ring frame mounting with 300mm/200mm wafers and removing of back grinding tape, this mounter supports the DBG (Dicing Before Grinding) process, which is ideal for thin chip fabrication. |
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| 8. |
Inline Compatible with DISCO Corporation's FG8000 series
By combining this mounter with the DISCO Corporation's DFG8000 series, an inline system with the world's smallest work space-capable of drastically reducing the risk of damage during the handling of thin waferscan be structured. |
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Vision System
(wafer ID reader & barcode attachment system) |
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Batch cutting |
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DBG Process compatibility |
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In-line operation with DISCO Corporation DGP8000 Series |
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A. Wafer Loading, Scanning, and Unloading
The load status of the wafer in the cassette is detected automatically, and the wafer is then retrieved by robotic arm and transferred to the alignment table (also functions as inspection table).
B. Wafer Alignment
The wafer is aligned by a CCD camera system with reference to the orientation flat or V-notch.
C. UV Irradiation
The wafer is transferred to the UV irradiation unit on the wafer delivery pad, where the back grinding tape is uniformly irradiated with UV, and then transferred to the mounting table.
D. Frame Loading
The frame piled up on the frame cassette is removed one by one and set on the mounting table.
E. Tape Attachment
Following UV irradiation, the wafer is set on the mounting table, and while the mounting table moves back and forth, pre-cut tape is attached to the wafer and frame with a press roller. A tape pre-cutting mechanism with a unique in-line batch cutting system may be installed as an option.
F. BG Tape Peeling
The back grinding tape of the wafer attached to the frame is peeled off. The tape is collected into the equipment's waste box.
G. Wafer Storage
The wafer attached to the frame is stored in the frame cassette.
H. Wafer Control System (Optional)
With this system, an ID number on the wafer is read, the data is then converted to barcode, and a label is attached. The wafer control system makes it possible to establish FA (factory automation) for the assembly process. |
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| 1. |
Built-in DAF
Lamination Mechanism
Standardly equipped with a DAF lamination mechanism,
a high demand feature for stacked packages and other
applications. This multi-function equipment is capable
of handling UV irradiation on BG Tape DAF lamination,
mounting to dicing frame, and back grinding tape removal.
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| 2. |
Reduced Footprint
Extremely compact in design, the equipment measures 2,200mm(W)x3,700mm(D)x1,800mm(H). |
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| 3. |
Dicing Tape Lamination
using Batch Cut System (Optional)
Even if non pre-cut dicing tape is used, the optionally
installed tape cutting mechanism with a unique batch
cut system will not damage the ring frame as the tape
cutting is conducted inside the equipment. |
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| 4. |
Heat Seal/Adhesion
Peeling Tape Lamination
For back grinding tape removal, both heat seal format and adhesive
tape format (optional) can be used together in accordance
with the physical properties of the back grinding tape
used.
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| 5. |
Supports DBG
Process
In addition to regular ring frame mounting with 300mm/200mm wafers and removing
of back grinding tape, this mounter supports the DBG (Dicing
Before Grinding) process, which is ideal for thin chip fabrication. |
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| 6. |
Inline Compatible
with DISCO Corporation's FG8000 series
By combining this mounter with the DISCO Corporation's
DFG8000 series, an inline system with work space-capable of drastically reducing the risk
of damage during the handling of thin waferscan be
structured. |
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| 1. |
Industry's First
Pre-cut Tape Handling Mounter
Designed to conserve resources and improve productivity,
the RAD-2500 F/8 incorporates an abundance of know-how
and utilizes a revolutionary pre-cut method. |
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| 2. |
Proven Reliability
Distributed worldwide, the repeat orders for RAD-2500 F/8
are proof of the equipment's recognition for its outstanding
reliability. |
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| 3. |
High Speed Operation
Max throughput is over 100 wafers per hour. While maintaining
product quality, the equipment guarantees speedy and dependable
work. |
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Can also be used
for special mounting of package substrates (special specification). |
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| RAD-2500 m/12 |
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| 1. |
Semi-Automatic
Mounting System for Pre-cut Tape
Allows easy operation using pre-cut tapes. Simply
set the wafer and frame to automatically apply
dicing tapes.
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| 2. |
Safety
Ensured for Manual Process
With no cutter, the equipment is extremely safe.
Elimination of the tape cutting process substantially
increases efficiency. |
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| 3. |
TTC System
for Accurate Tape Application
The equipment's TTC system enables tape application
with tape tension control, prevents air infiltration,
and provides ideal tension for back-end process. |
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Cracked
Wafer Mounting Fully Supported
Optional feature to mount partial wafers is available
to effectively reduce wafer waste. |
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| 5. |
Reduced Footprint
and High Performance
High performance and yet compact, the equipment
allows effective use of workspace and increases
work efficiency. |
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Static
Eliminator |
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Top
Cover |
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Cracked Wafer Mounting
Feature |
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Wafer Positioning
Pins |
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ISO 9001 : 2000
Certificate JP08/060975
Lintec Corporation
Agatsuma Plant
Technology Administration/R&D Div. Research Laboratory/Planning Dept.
Business Administration Div. Advanced Materials Operations. |
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ISO 9001 : 2000
Certificate JQA-QM7787
Lintec Corporation
Ina Technology Center |
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ISO 14001 : 2004
Certificate JQA-EM0750
Lintec Corporation
(Includes Agatsuma Plant, Ina Technology Center, Research
Laboratory, and others) |
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| At Lintec's Research Laboratory (Saitama Prefecture) and
Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing
are developed and manufactured, and at the Ina Technology Center (Saitama
Prefecture) where related equipment are developed and manufactured,
certification has been obtained for the ISO 9001 quality management
system and the ISO 14001 environment management system. |
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