Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.
LINTEC Corporation
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LINTEC Corporation   Advanced Materials Operations
UV Irradiation System
RAD-2010 F/12 (300mm Fully-Automatic UV Irradiation System)
RAD-2010 F/12 (300mm Fully-Automatic UV Irradiation System)
1.  Compact, High-Throughput
Handles wafers of both 12 inches and 8 inches. More compact with an integrated cassette loader and unloader. Provides high-throughput with two processing lines.
   
2.  High Quality and High Performance
This is a sophisticated system developed by Lintec, the industry-leading supplier of UV curable dicing tapes. Supports the optimization of illuminance and light intensity with high output UV lamp and light intensity checking for each wafer process, and performs UV irradiation in an environment that prevents inhibition by oxygen*.

* Conducts UV irradiation in a chamber filled with nitrogen to expel oxygen which inhibits UV curing.
   
3.  Smooth and Safe Operation
A large touch panel improves operability. Ensures safety for operations and maintenance, complying with the SEMI safety guidelines, from design to assembly stages.
Supports CE marking
   
4.  Factory Automation of Assembly Process
Realizes factory automation of total assembly process by integrating host communication function and inline system.

Options
Host Communication
(Communication format: Conforms to SECS I and HSMS/Software: Conforms to GEM)
Barcode System
Visual Inspection Support System
Double loader/unloader
Operation Process (RAD-2010 F/12)
Operation Process Diagram A. Work Loading, Scanning, and Unloading
A work is automatically detected in the cassette, and then passed to the alignment unit.

B. Irradiation Preparation
The work is aligned, placed onto the lower pass line of the transfer arm, and then transferred to the UV irradiation starting position. The chamber is filled with nitrogen at this time.

C. UV Irradiation
The work in the chamber is moved above the UV lamp to be uniformly irradiated.


D. Storage Preparation
The UV-irradiated work is transferred along the upper pass line of the chamber and transfer arm, and then waits for being unloaded in the upper alignment position.

E. Work Storage
After the next work is loaded into the chamber, the processed work is stored in the cassette.
RAD-2000 F/8 (200mm Fully-Automatic UV Irradiation System)
RAD-2000 F/8 (200mm Fully-Automatic UV Irradiation System)
1.  Fully-Automatic Improved Process Speed
A fully-automatic system with integrated cassette loader and unloader increases operational efficiency.
   
2.  Controllable Illuminance and Light Intensity
Allows control of illuminance and light intensity for effective UV irradiation with high output UV lamp.
   
3.  Uniform Irradiation of Entire Surface
Employs method in which irradiation takes place during movement, achieving uniform irradiation of the entire surface.
   
4.  Self-diagnosis Function Supports Quality Control
This is high performance system incorporates a self-diagnosis function that accurately detects irradiation errors.
RAD-2000 m/12 (300mm Semi-Automatic UV Irradiation System)
RAD-2000 m/8 (200mm Semi-Automatic UV Irradiation System)
RAD-2000 m/8 (200mm Semi Automatic UV Irradiation Unit)
1.  High Precision Irradiation with Constant Illuminance
Square-wave lighting utilizing a high frequency inverter offers high precision, reliable UV irradiation with optimized illuminance and light intensity.
   
2.  Automatic Feedback Illuminance Control
A built-in sensor enables feedback control to keep constant UV lighting output. By maintaining steady lighting throughout the lamp's life, the system contributes to fabrication of a constant quantity of semiconductors.
   
3.  Easy Operation with One Press of a Button
Improves operability and stability with center loading, while significantly stepping up operational efficiency.
   
4.  Quick and Uniform Irradiation of Entire Surface
Uniform irradiation of the entire surface is assured through mobilization of a nitrogen-filled chamber. Irradiation speed can be freely adjusted in accordance with conditions including wafer size and type.
ISO 9001:2000 Certificate JP08/060975   ISO 9001 : 2000
Certificate JP08/060975
Lintec Corporation
  Agatsuma Plant
  Technology Administration/R&D Div. Research Laboratory/Planning Dept.
  Business Administration Div. Advanced Materials Operations.
ISO 9001:2000 Certificate JQA-QM7787   ISO 9001 : 2000
Certificate JQA-QM7787
Lintec Corporation
  Ina Technology Center
ISO 14001:2004 Certificate JQA-EM0750   ISO 14001 : 2004
Certificate JQA-EM0750
Lintec Corporation
  (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)
At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.
Adwill
Semiconductor Products
Products for Back-grinding Process
Products for Dicing/Mounting Process
Dicing Tape
Dicing Die Bonding Tape
Pressurized Curing System
Wafer Mounter
UV Irradiation System
Backside Coating Tape
LC Tape Laminator
Barcode Label for Clean Room Use
Products for DBG Process
Electronic Component Products
Coated Films for the Production of Multilayer Ceramic Capacitors
SPECIAL CONTENTS
Virtual Exhibition
Adwill products information from SEMICON Japan2009 is available.
Back number
Virtual Exhibition (2008)
Virtual Exhibition (2007)
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