Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.
LINTEC Corporation
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LINTEC Corporation   Advanced Materials Operations
Dicing Tape
D series (UV Curable Dicing Tape)
D series (UV Curable Dicing Tape) Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve chip quality, and fully applicable to chips of multiple sizes.

1.  Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small chips. 
   
2.  Supports instant control of adhesion by UV irradiation, allowing large chips to be picked up easily.
   
3.  Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
   
4.  Prevents contact damage of chips with superb expandability, which is not reduced by UV irradiation.
   
5.  Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
   
6.  Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
   
7.  Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.
G series (Non-UV type Dicing Tape)
G series (Non-UV type Dicing Tape) The Adwill G series is a line of removable dicing tapes. With this type of tape, adhesive strength remains stable after wafer mounting. Using a film with superb flexibility and expansion characteristics, the tape also has outstanding expandability. It can be used with chips of multiple sizes, and is outstanding in terms of cost performance. Moreover, it can be used in an adhesive coating process environment that meets Class 100 (ANSI 209b) standards, and can be readily applied in fabrication processes.
D series/G series Product Composition Pre-cut Tape
D series/G series Product Composition Pre-cut Tape
ISO 9001:2000 Certificate JP08/060975   ISO 9001 : 2000
Certificate JP08/060975
Lintec Corporation
  Agatsuma Plant
  Technology Administration/R&D Div. Research Laboratory/Planning Dept.
  Business Administration Div. Advanced Materials Operations.
ISO 9001:2000 Certificate JQA-QM7787   ISO 9001 : 2000
Certificate JQA-QM7787
Lintec Corporation
  Ina Technology Center
ISO 14001:2004 Certificate JQA-EM0750   ISO 14001 : 2004
Certificate JQA-EM0750
Lintec Corporation
  (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)
At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.
Adwill
Semiconductor Products
Products for Back-grinding Process
Products for Dicing/Mounting Process
Dicing Tape
Dicing Die Bonding Tape
Pressurized Curing System
Wafer Mounter
UV Irradiation System
Backside Coating Tape
LC Tape Laminator
Barcode Label for Clean Room Use
Products for DBG Process
Electronic Component Products
Coated Films for the Production of Multilayer Ceramic Capacitors
SPECIAL CONTENTS
Virtual Exhibition
Adwill products information from SEMICON Japan2009 is available.
Back number
Virtual Exhibition (2008)
Virtual Exhibition (2007)
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