Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.

		Advanced Materials Operations [Top Page] Sitemap Japanese

Advanced Materials Operations [Top Page] > Adwill > Products for Dicing/Mounting Process > LC Tape Laminator

1. LC Tape Laminator An optimal system has been realized based on the concept of maximizing the property of the backside coating tape (LC Tape) used in flip chip packaging. Lintec revised the existing RAD-3500F/8DBS, and designed the new LC Tape laminator to correspond to 300 mm wafers.     2. High-precision tape lamination attained By applying Lintec's unique lamination mechanism, high-precision tape lamination that prevents the formation of voids has been achieved.     3. Internal tape pre-cutting mechanism The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination. Double cassette loading Wafer ID reader   ISO 9001 : 2000 Certificate JP08/060975 Lintec Corporation   Agatsuma Plant   Technology Administration/R&D Div. Research Laboratory/Planning Dept.   Business Administration Div. Advanced Materials Operations.   ISO 9001 : 2000 Certificate JQA-QM7787 Lintec Corporation   Ina Technology Center   ISO 14001 : 2004 Certificate JQA-EM0750 Lintec Corporation   (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others) At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

Adwill products information from SEMICON Japan2009 is available. Back number Virtual Exhibition (2008) Virtual Exhibition (2007)

© Copyright Lintec Corporation. All rights reserved.