Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.

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Advanced Materials Operations [Top Page] > Adwill > Products for Dicing/Mounting Process > Backside Coating Tape

LC Tape was developed to protect and reinforce a chip's backside in applications such as flip chip, in which the chip is mounted onto a substrate from the circuit surface. While protecting and reinforcing the chip's backside, the tape also blocks off light, reducing its adverse effects on the circuit surface. Since this product comes as a tape, uniformity in thickness can be maintained through simplified operations. Lamination can take place at relatively low temperatures so that the risk of circuit damage from heat is reduced. 1.  A special adhesive tape that reduces damage to the circuit surface by blocking off light at the same time that it protects and reinforces the chip's backside. Featuring both high quality and stability, the tape has passed reliability tests in environments of high temperature and humidity. 2.  Unlike a coating of liquid mold material, this product is available as a tape, ensuring outstanding uniformity in thickness, and allowing the simplification of conventional processes. 3.  Since laminations can be done at relatively low temperatures, damage to circuitry from heat is reduced. Can be used with Lintec's high performance laminator (RAD-3600) for tape lamination, which in turn contributes to the structuring of highly reliable production lines. 4.  The tape is laminated to the chip's backside before dicing, which helps prevent wafer chipping during dicing. 5.  Laser markings such as the manufacturer's name or lot number can be inscribed on the tape's backside.   ISO 9001 : 2000 Certificate JP08/060975 Lintec Corporation   Agatsuma Plant   Technology Administration/R&D Div. Research Laboratory/Planning Dept.   Business Administration Div. Advanced Materials Operations.   ISO 9001 : 2000 Certificate JQA-QM7787 Lintec Corporation   Ina Technology Center   ISO 14001 : 2004 Certificate JQA-EM0750 Lintec Corporation   (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others) At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

Adwill products information from SEMICON Japan2009 is available. Back number Virtual Exhibition (2008) Virtual Exhibition (2007)

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