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| LE Tape is a high value-added tape that combines
the functions of dicing tape and die bonding material.
Prevents adhesive bleeding or unevenness by transferring
the adhesive uniformly onto the backside of the chip at
pick-up. Particularly suited for die bonding of thick stacked
CSPs. Processing is also simplified since the same tape
can be used in the process from dicing to bonding. |
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| 1. |
During dicing, the tape secures wafers in
a manner similar to regular dicing tape. It is a multi-functional
tape that transfers an adhesive layer to the backside
when a chip is picked up. |
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| 2. |
Because the DAF lamination process can be
omitted, processing is simplified, while damage to the
wafer caused by heat treatment during adhesion is eliminated
as well. |
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| 3. |
Because heat curing (wafer mounting) can be
done at low temperatures, the probability for damage to
the wafer from heating is reduced. |
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| 4. |
There are no problems such as adhesive bleeding
or chip tilt. |
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| 5. |
Two new additions to the lineup are the ES-type, which conforms well to the bumps and depressions
in the substrate, the EW-type, which yields same-size
stacks, and the SD-type, for thin chip stacked packages. Suitable for improving production efficiency
and die bonding of thin, stacked packages. |
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| Subject |
LE Tape |
Liquid Adhesive |
| Adhesive
Condition |
Uniform over whole surface |
Non-uniform, partial coverage |
| Effect on
Chip Size |
No |
Yes |
| Tool and
Adhesive Layer Control |
None required |
Required |
| Bleeding
of Adhesive During Curing |
No |
Yes |
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Image of SD-type in use |
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| 1. |
Adhesive thickness is in uniform and no adhesive bleeds out the edge making bonding at chip size level possible. |
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| 2. |
Maintains proper elasticity modulus and enables excellent wire bonding after die bonding. |
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Image of ES-type in use |
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| 1. |
With this tape, bumps
on the substrate can be fully covered thanks to control
of the adhesive material's elastic modulus. Similar to
conventional liquid adhesives, it reduces the risk of damage
to a package from residual air voids. |
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| 2. |
Compared to conventional products, Adwill
LE Tape uses an adhesive agent for outstanding adhesion
to substrate materials. |
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Image of EW-type in use |
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Same-size, stacked package
EW-type used |
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| 1. |
With thicker adhesive layer and the control of
the elastic modulus under a heating environment during die
bonding, the wire underneath normally
50 to 60 μm in height, is embedded in the adhesive layer
during lamination. |
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| 2. |
Allows stabilized stacks of the same size as
the wire is securely embedded and sealed in the adhesive
layer, eliminating damage to the wire itself as well as contact
with the bottom surface of the upper layer chip. |
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| 3. |
Without the need for a spacer to maintain wire
height between chips, the tape makes thin packaging possible
and improves production efficiency. |
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ISO 9001 : 2000
Certificate JP08/060975
Lintec Corporation
Agatsuma Plant
Technology Administration/R&D Div. Research Laboratory/Planning Dept.
Business Administration Div. Advanced Materials Operations. |
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ISO 9001 : 2000
Certificate JQA-QM7787
Lintec Corporation
Ina Technology Center |
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ISO 14001 : 2004
Certificate JQA-EM0750
Lintec Corporation
(Includes Agatsuma Plant, Ina Technology Center, Research
Laboratory, and others) |
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| At Lintec's Research Laboratory (Saitama Prefecture) and
Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing
are developed and manufactured, and at the Ina Technology Center (Saitama
Prefecture) where related equipment are developed and manufactured,
certification has been obtained for the ISO 9001 quality management
system and the ISO 14001 environment management system. |
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