Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.
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Products for Dicing/Mounting Process
These products substantially contribute to improved productivity and labor conservation. Products include a wafer mounter, which fixes the wafer in a ring frame for the dicing process undertaken in semiconductor fabrication, and also attaches and fixes the dicing tape; a UV irradiation equipment that irradiates wafers with ultraviolet light after dicing, which reduces adhesion so that chips can be picked up easily; and a barcode & vision system that enables barcode management of wafers.
Dicing Tape
Dicing Tape

Two types of dicing tape are available: the D series of UV curable dicing tape, for which adhesion is reduced by UV irradiation for easier pick-up at die bonding, and the G series of removable dicing tape that features outstanding long-term stability.
Dicing Die Bonding Tape
Dicing Die Bonding Tape
Dicing die bonding tape (LE Tape) is a multi-function tape that combines the functions of dicing tape and die-attach film. After dicing, the adhesive layer transfers over to the chip backside and is used for die bonding. It offers a solution to problems such as bleeding of liquid adhesive, facilitates the simplification of process control, and improves product reliability.
Pressurized Curing System
Pressurized Curing System
A heat and pressure curing system designed to eliminate fine air voids caused by die bonding with LE Tape onto uneven, narrow pitched substrates.
Wafer Mounter
Wafer Mounter
This is a high performance wafer mounter of high-throughput that includes a revolutionary pre-cut tape process. The lineup consists of four product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.
UV Irradiation System
UV Irradiation System
High performance equipment that supports greater efficiency and uniformity in UV irradiation. The lineup consists of five product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.
Chip Backside Protective Tape
Backside Coating Tape
LC Tape is a special adhesive tape of the carrier-less type that protects a chip's backside in flip chip mounting. While protecting and reinforcing the chip’s backside, this tape also blocks light and reduces adverse effects on circuit surfaces.
LC Tape Laminator
LC Tape Laminator
A laminator exclusively designed to optimize the lamination of LC Tape on 300mm wafers.
Clean Room Labels
Barcode Label for Clean Room Use
Adopting a label substrate that does not generate dust easily, this is a tracking label hat is ideal for clean room use. The lineup also includes heatproof label material that features outstanding heat resistance, solvent resistance, and abrasion resistance properties.
Adwill
Semiconductor Products
Products for Back-grinding Process
Products for Dicing/Mounting Process
Dicing Tape
Dicing Die Bonding Tape
Pressurized Curing System
Wafer Mounter
UV Irradiation System
Backside Coating Tape
LC Tape Laminator
Barcode Label for Clean Room Use
Products for DBG Process
Electronic Component Products
Coated Films for the Production of Multilayer Ceramic Capacitors
SPECIAL CONTENTS
Virtual Exhibition
Adwill products information from SEMICON Japan2009 is available.
Back number
Virtual Exhibition (2008)
Virtual Exhibition (2007)
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