Adwill represents state-of-the-art tape and equipment that support fabrication of thinner and tougher IC chips.

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This is a chip fabrication process in which, after the circuit surface has been half-cut, the wafer is made ultra-thin through back grinding while the chip is diced. With an in-line system comprised of the Lintec's Fully-Automatic Multifunction Wafer Mounter (RAD-2510 F/12Sa) and Disco Corporation's grinder, the risk of damage to wafers is reduced and ultra-thin chips (25μm or less) can be produced with stability. DBG Surface Protective Tape This is a wafer surface protective tape that fully prevents infiltration of grinding fluid during polishing, as well as the generation of chips or cracks. The tape is laminated by the "RAD-3500 series," BG Tape Laminator. 1.  Strong adhesive force fully prevents infiltration of grinding fluid and chip dust during grinding. 2.  Absorption and/or relief of compression stress and shear stress during grinding. 3.  Suppresses cracking due to contact between chips. 4.  Adhesive strength can be freely adjusted through UV irradiation. Grinding Stress Model for Surface Protective Tape DBG Pick-up Tape A special-purpose pick-up tape for fully transferring chips, diced after back grinding, from surface protective tape to ring frame. The tape is mounted with the "RAD-2510 F/12Sa," Fully-Automatic Multifunction Wafer Mounter. 1.  Chips diced after back grinding are fully transferred. 2.  Stress to chips during pick-up is minimized. 3.  Cracking due to contact between chips is suppressed 4.  Ultra-thin, large chips can be picked up securely by using a special UV curable tape.   RAD-2510 F/12Sa (300mm Fully-Automatic Multifunction Wafer Mounter for DBG Process)       RAD-3500 series (BG Tape Laminator) Area and thickness of chip to which pick-up tape is applied     ISO 9001 : 2000 Certificate JP08/060975 Lintec Corporation   Agatsuma Plant   Technology Administration/R&D Div. Research Laboratory/Planning Dept.   Business Administration Div. Advanced Materials Operations.   ISO 9001 : 2000 Certificate JQA-QM7787 Lintec Corporation   Ina Technology Center   ISO 14001 : 2004 Certificate JQA-EM0750 Lintec Corporation   (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others) At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

Adwill products information from SEMICON Japan2008 is available. Back number Virtual Exhibition (2007)

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