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Advanced Materials Operations [Top Page] > Adwill > Products for Back Grinding Process > BG Tape Remover

1.  Ideal Tape Peeling An ideal 180-degree peeling technique (patent application completed) is used when removing back grinding tape from the wafer. The technique minimizes stress to the wafer while the tape is removed, allowing the equipment to process thin wafers.     2.  Elimination of Damage to Wafer Circuit Surface Peeling tape is thermo-compression bonded to the BG Tape within 3mm from the wafer's periphery. This greatly reduces residual adhesive as well as damage to the wafer circuit surface usually caused by peeling tape lamination.     3.  Outstanding Cost Performance Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the back grinding tape.     4.  Automatic Control of UV Intensity and Quantity of Light The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light. This means a uniform level of UV intensity throughout the lamp's service life, ensuring stable tape removing even when using UV curable back grinding tape.     Host Communication Function (Communication format: Conforms to SECS I and HSMS/Software: Conforms to GEM) Barcode Reader A. Wafer Loading, Scanning, and Unloading Wafer scan sensor automatically detects the wafer storage conditions. A robotic arm with three-axis control transfers the wafer to the UV irradiation unit. B. UV Irradiation The wafer is uniformly irradiated with UV rays in the chamber, and transferred to the alignment unit by alignment conveyor. C. Wafer Alignment The wafer is aligned with reference to the orientation flat or V-notch, and then set by transfer arm onto the peeling table. D. BG Tape Removing Thermo-compression peeling tape is bonded by heat plate within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. E. Wafer Storage The removed back grinding tape and the peeling tape are placed into a dust box and the wafer is unloaded into a cassette by robotic arm. ·  Fully-automatic BG Tape remover for 200mm wafers. ·  Applies the 180-degree tape peeling technique to remove back grinding tape from the wafer, minimizing stress on the wafer. ·  Capable of processing large diameter, thin wafers when used with the E series of UV curable back grinding tape. 1.  Compactly Designed High Performance Remover Suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace. *The equipment is compatible with both wafer and wafer mounted to ring frame.     2.  Easy-to-operate Semi-Automatic Type Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.     3.  Stable Removing of BG Tape Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the BG Tape within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of large diameter, thin wafers.   ISO 9001 : 2000 Certificate JP08/060975 Lintec Corporation   Agatsuma Plant   Technology Administration/R&D Div. Research Laboratory/Planning Dept.   Business Administration Div. Advanced Materials Operations.   ISO 9001 : 2000 Certificate JQA-QM7787 Lintec Corporation   Ina Technology Center   ISO 14001 : 2004 Certificate JQA-EM0750 Lintec Corporation   (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others) At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

Adwill products information from SEMICON Japan2009 is available. Back number Virtual Exhibition (2008) Virtual Exhibition (2007)

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