BG Tape Laminator | Products for Back Grinding Process | Adwill | LINTEC Corporation Advanced Materials Operations

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Advanced Materials Operations [Top Page] > Adwill > Products for Back -Grinding Process > BG Tape Laminator

RAD-3510 F/12 (300mm Fully Automatic BG Tape Laminator)

Unique Tape Lamination Format
This laminator is mounted with the very latest TTC system (patent registered) for preventing bow or damage to ultra-thin wafers. Capable of high precision tension control during tape lamination, the equipment substantially reduces residual stress to thin wafers after back grinding.

Use of a Multi-joint Robotic Arm
Features a multi-joint robotic arm (patent application completed) for wafer handling and tape cutting within the laminator. In tape cutting, a high precision cutting surface is obtained through accurate control of cutter angles, with no problems during back grinding.

High Operability Realized
A high degree of operability is realized through improvements in the functions on the dialogue-type touch panel located on the front of the equipment. Each type of lamination condition can be set.

TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment's touch panel.


	Double cassette loading
	Wafer box loading
	Wafer ID reader
	RFID traceability system

A. Wafer Loading, Scanning, and Unloading
Detection occurs by scanning wafers inside the cassette for transport. Based on these results, wafers are retrieved by a multi-axis robotic arm and transported to the alignment section.

B. Wafer Alignment
Taking V-notch or OF (Orientation Flat) as standard, the wafer's outer circumference is centered and the wafer is transported to the mounting table.

C. BG Tape Lamination
Back grinding tape is laminated by a press roller (roll-to-roll method). Low-tension lamination is realized with the latest TTC system.

D. Tape Cutting
Through the control of three-dimensional movement (x, y, θ), the tape is cut by moving the cutter knife along the wafer's outer circumference.

E. Residual Tape Processing
The residual tape left after cutting is wound up into a roll.

F. Wafer Storage
The wafer is unloaded by robotic arm into a cassette.

RAD-3500 m/12 (300mm Semi Automatic BG Tape Laminator)

1.	Suitable for large diameter, thin wafers TTC system enables BG Tape to be laminated on the wafer without applying stress. Hence, the laminator can also be used for processing large diameter, thin wafers.

2.	Compactly Designed High Performance Laminator Suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.

3.	Easy-to-operate Semi-Automatic Type Once the wafer is set on the mounting table, the BG Tape can be automatically laminated and cut with simple control inputs.

4.	New Tape Cutting Technique Similar to the fully-automatic type, BG Tape is cut by rotating the table while the cutter knife is held in a fixed position. This means smoother tape cutting even for corners of the orientation flat, where tape chips are easily generated, for improved product reliability in the back grinding process.

		ISO 9001 : 2000 Certificate JP08/060975 Lintec Corporation Agatsuma Plant Technology Administration/R&D Div. Research Laboratory/Planning Dept. Business Administration Div. Advanced Materials Operations.

		ISO 9001 : 2000 Certificate JQA-QM7787 Lintec Corporation Ina Technology Center

		ISO 14001 : 2004 Certificate JQA-EM0750 Lintec Corporation (Includes Agatsuma Plant, Ina Technology Center, Research Laboratory, and others)

At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

Adwill products information from SEMICON Japan2009 is available.

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Virtual Exhibition (2008)
Virtual Exhibition (2007)