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| This lineup consists of an abundant array
of products that substantially contribute to improved workability and
the stabilization of quality for back grinding in the semiconductor
fabrication process. Products include BG Tape/Peeling Tape for preventing
damage of wafer circuit surfaces during back grinding, a BG Tape Laminator
for automatically mounting surface protective tape, and a BG Tape Remover
for automatically removing surface protective tape from wafers after
back grinding. |
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| Two types of back grinding tape are available.
The "E series" which can be removed without placing stress
on the wafer by decreasing adhesion by UV irradiation,
and the "P series" non-UV type. In addition, there's
the "S series" peeling tapes. |
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| This is an advanced laminator for thin wafers
that achieves tension-free lamination of back grinding
tape. The lineup consists of three product types that vary
in accordance with fully-automatic or semi-automatic functions,
as well as wafer size. |
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| This is an advanced back grinding tape remover
that peels tape while minimizing wafer stress. The lineup
consists of three product types that vary in accordance
with fully-automatic or semi-automatic functions, as well
as wafer size. |
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