Adwill: Tape and equipment for semiconductor device production.

Exhibition information

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO
  • Dates : Jan. 13(Wed.) - 15(Fri.)
  • Venue : E53-40 Tokyo Big Sight, Japan
Concept Tape × Equipment
LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available. We presented our own solution for “Substrate/Plating/Etching Process”, “Power Device Process” and “Advanced Packaging Technologies”.
* Panels displayed at the exhibition can be downloaded in PDF.

Substrate/Plating/Etching Process

Adwill tapes and equipment for special processes are proposed.

Power Device Process

Adwill tapes and equipment for peculiar manufacturing process of power device are presented.

Advanced Packaging Technologies

Adwill tapes and equipment for advanced IC packaging are proposed.

What is Adwill?

Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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