Adwill: Tape and equipment for semiconductor device production.

UV Irradiation System

RAD-2010F/12 (300mm Fully-Automatic UV Irradiation System)

Catalog (PDF) Download

  • RAD-2010F/12 (PDF:114KB)
1.Compact and high-throughput
This equipment handles wafers of both 300mm and 200mm. More compact with an integrated cassette loader and unloader. Provides high-throughput with two processing lines.
2.High quality and high performance
This is a sophisticated system developed by Lintec, the industry-leading supplier of UV curable dicing tapes. Supports the optimization of illuminance and light intensity with high output UV lamp and light intensity checking for each wafer process, and performs UV irradiation in an environment that prevents inhibition by oxygen*.
  • *Conducts UV irradiation in a chamber filled with nitrogen to expel oxygen which inhibits UV curing.
3.Smooth and safe operation
A large touch panel improves operability. Ensures safety for operations and maintenance, complying with the SEMI safety guidelines, from design to assembly stages.
  • Supports CE marking
4.Factory automation of assembly process
It realizes factory automation of total assembly process by integrating host communication function and inline system.
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
  • Barcode reader for selecting recipes
  • Barcode reader for reading ring frame ID
  • Double loader/unloader

RAD-2010F/12 Operation Process

A.Workpiece Loading, Scanning, and Unloading
A workpiece is automatically detected in the cassette, and then passed to the alignment unit.
B.Irradiation Preparation
The workpiece is aligned, placed onto the lower pass line of the transfer arm, and then transferred to the UV irradiation starting position. The chamber is filled with nitrogen at this time.
C.UV Irradiation
The workpiece in the chamber is moved above the UV lamp to be uniformly irradiated.
D.Storage Preparation
The UV-irradiated workpiece is transferred along the upper pass line of the chamber and transfer arm, and then waits for being unloaded in the upper alignment position.
E.Workpiece Storage
After the next workpiece is loaded into the chamber, the processed workpiece is stored in the cassette.

RAD-2000F/8 (200mm Fully-Automatic UV Irradiation System)

Catalog (PDF) Download

  • RAD-2000F/8 (PDF:121KB)
1.Fully-automatic improved process speed
This is a fully-automatic system with integrated cassette loader and unloader increases operational efficiency.
2.Controllable illuminance and light intensity
This equipment allows control of illuminance and light intensity for effective UV irradiation with high output UV lamp.
3.Uniform irradiation of entire surface
It adopts the method in which irradiation takes place during movement, achieving uniform irradiation of the entire surface.
4.Self-diagnosis function supports quality control
This is high performance system incorporates a self-diagnosis function that accurately detects irradiation errors.
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)

RAD-2010m/12 (300mm Semi-Automatic UV Irradiation System)

Catalog (PDF) Download

  • RAD-2010m/12 (PDF:128KB)
1.Comparison with our conventional 300mm semi-automatic UV irradiation system
  • Footprint reduced by approximately 16.5%
  • Operability improved by concentrating operation interfaces in one place
  • Visibility improved by installing touch screen at an angle of 45 degrees (conforms to SEMI standard)
  • Double irradiation of 150mm wafer ring frames (optional)
2.High precision irradiation with constant illuminance
Square-wave lighting utilizing a high frequency inverter offers high precision, reliable UV irradiation with optimized illuminance and light intensity.
3.Automatic feedback illuminance control
A built-in sensor enables feedback control to keep constant UV lighting output. By maintaining steady lighting throughout the lamp's life, the system contributes to fabrication of a constant quantity of semiconductors.
4.Easy operation with one button
This equipment improves operability and stability with center loading, while significantly stepping up operational efficiency.
5.Quick and uniform irradiation of entire surface
Uniform irradiation of the entire surface is assured through mobilization of a nitrogen-filled chamber. Irradiation speed can be freely adjusted in accordance with conditions including wafer size and type.