Adwill: Tape and equipment for semiconductor device production.

LC Tape Laminator

RAD-3600F/12 (300mm Fully-Automatic LC Tape Laminator)

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  • RAD-3600F/12 (PDF:131KB)
1.LC Tape laminator
This is an optimal system realized to meet the property of the backside coating tape (LC Tape), which is used in Flip Chip packaging.
2.High-precision tape lamination attained
By applying Lintec's unique lamination mechanism, high-precision tape lamination without voids has been achieved.
3.Internal tape pre-cutting mechanism
The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination.
Options
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
  • Double cassette loading
  • Wafer ID reader