Adwill: Tape and equipment for semiconductor device production.

Pressurized Curing System

RAD-9100-450 RAD-9100-050


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  • RAD-9100-450 (PDF:126KB)
  • RAD-9100-050 (PDF:121KB)
1.Void elimination after die bonding
The heat curing process under high-pressure environment helps eliminate fine air voids created after die bonding on uneven areas of substrates. It is best suited for use with Lintec's dicing die bonding tape (LE Tape).
2.Ability to set heating and pressurizing options
Operators are able to set desired heating temperatures and pressure levels to meet the required curing condition for each tape and substrate (step curing method).
3.Convenient touch screen data entry
Parameters are easily set by a touch screen to select conditions for each product.
4.Two types available
Product line-up includes equipments that are capable of handling small volume production such as in for research labs:RAD-9100-050, as well as large volume production:RAD-9100-450.
5.No need for substrate baking process
Introduction of this process eliminates the need for substrate baking process prior to die bonding.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

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Exhibition Information


LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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