Adwill: Tape and equipment for semiconductor device production.

BG Tape

Two types of back grinding tape are available: UV curable type, E series, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type, P series. The peeling tape, S series, is also available.

Back Grinding Tape(Video Clips)

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E series (UV Curable BG Tape)

Product Information

  • Back Grinding Process
    ·Standard·Ultra Thin Grinding ·(thickness: >40µm)·Micro Bump (including ink dot)·Bump (height: <150µm)·High Bump (height: <250µm)
  • Dicing Before Grinding Process
    ·Standard

The Adwill E series of UV curable back grinding tape prevents damage on wafer surface during back grinding and contamination caused by grinding fluid and/or debris. Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy peeling without stress on the wafer. This feature makes the series suitable for the processing of thin wafers.

Standard Type (General-purpose)

  1. 1.Since contamination on the wafer surface is extremely minimal, the wafer does not require cleaning after back grinding.
  2. 2.The adhesive coating environment exceeds class 100 (US Federal Standard 209b).

Tape Types for Thin, Bump Wafers

  1. 1.The inherent stress relaxation capability of this tape, curtails wafer bow that would otherwise arise after back grinding due to residual stress during tape lamination. Moreover, by dispersing stress during back grinding of bump wafers, this tape prevents wafer damage and wafer dimples, while enhancing wafer thickness accuracy.
  2. 2.High precision tape thickness accuracy ensures precision wafer thickness after back grinding.

P series (Non-UV type BG Tape)

Product Information

  • Back Grinding
    ·Standard (thickness: >75µm)·Thin Grinding (thickness: >50µm)
  1. 1.Fully protects the wafer surface during back grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris
  2. 2.There is virtually no residual adhesive after tape is peeled off.
  3. 3.For cases in which slight contamination remains because of wafer surface configuration, the line-up includes a type that can be removed by cleaning with pure water.
    Additionally, there is no danger of contamination from cleaning fluids because there are no water-soluble ingredients of light molecular weight in the adhesive.
  4. 4.High precision tape thickness accuracy ensures precision wafer thickness after back grinding.

S series (Peeling Tape)

  1. 1.A special-purpose tape for removing back grinding tape with the Wafer Mounter RAD-2500 series and the BG Tape Remover RAD-3000 series.
  2. 2.This tape, used in combination with each equipment, allows the removal of back grinding tape without damaging the wafer.
  3. 3.Regardless of the back grinding tape's material, the peeling tape is securely adhered by thermo-compression bonding, allowing the complete removal of the back grinding tape.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

What is Adwill?

Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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