1.Ideal tape peeling

An ideal 180-degree peeling technique is used when peeling back grinding tape from the wafer. The technique minimizes stress to the wafer while the tape is peeled, allowing the equipment to process thin wafers.

2.Elimination of damage to wafer circuit surface

Peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery. This greatly reduces residual adhesive as well as damage to the wafer circuit surface usually caused by peeling tape lamination.

3.Outstanding cost performance

Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the back grinding tape.

4.Automatic control of UV intensity and quantity of light

The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light. This means a uniform level of UV intensity throughout the lamp's service life, ensuring stable tape peeling even when using UV curable back grinding tape.

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Operation Process

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1.Stress on the wafer during peeling is reduced with the new peeling method

Using the latest heat seal peeling method, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer’s periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer. Having the new peeling method achieves a more stable peeling.

2.Back grinding tape peeling is performed without any contact with the wafer backside

By using our unique wafer holding table, back grinding tape peeling is performed without any contact with the wafer backside.

3.Adopts backside non-contact wafer handling method

By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially shaped backside used in the manufacturing processes of power devices and TSV.

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1.Ideal tape peeling

This equipment applies the 180-degree tape peeling technique to peel back grinding tape from the wafer, minimizing stress on the wafer.

2.Automatic control of UV intensity and quantity of light

The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light, which also enables stable peeling of UV curable back grinding tape.

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1.Compactly designed high performance remover

This equipment is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.

• *The equipment is compatible with both wafer and wafer mounted to ring frame.

2.Easy-to-operate semi-automatic type

Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.

3.Stable removing of BG Tape

Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery, and it is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of thin wafers.

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At Lintec's Research Laboratory (Saitama Prefecture) and Agatsuma Plant (Gunma Prefecture), where tapes for semiconductor manufacturing are developed and manufactured, and at the Ina Technology Center (Saitama Prefecture) where related equipment are developed and manufactured, certification has been obtained for the ISO 9001 quality management system and the ISO 14001 environment management system.

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• BG Tape
• BG Tape Laminator
• BG Tape Remover
• Carrier Exchanger