Adwill: Tape and equipment for semiconductor device production.

BG Tape Remover

RAD-3010F/12 (300mm Fully-Automatic BG Tape Remover)

Catalog (PDF) Download

  • RAD-3010F/12 (PDF:138KB)
1.Ideal tape peeling
An ideal 180-degree peeling technique is used when peeling back grinding tape from the wafer. The technique minimizes stress to the wafer while the tape is peeled, allowing the equipment to process thin wafers.
2.Elimination of damage to wafer circuit surface
Peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery. This greatly reduces residual adhesive as well as damage to the wafer circuit surface usually caused by peeling tape lamination.
3.Outstanding cost performance
Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the back grinding tape.
4.Automatic control of UV intensity and quantity of light
The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light. This means a uniform level of UV intensity throughout the lamp's service life, ensuring stable tape peeling even when using UV curable back grinding tape.
Options
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
  • Barcode reader for selecting recipes

RAD-3010F/12 (using UV Curable BG Tape) Operation Process

A.Wafer Loading, Scanning, and Unloading
Wafer scan sensor automatically detects the wafer storage conditions. A robotic arm with three-axis control transfers the wafer to the UV irradiation unit.
B.UV Irradiation
UV is uniformly irradiated on the wafer in the chamber, and transferred to the alignment unit by alignment conveyor.
C.Wafer Alignment
The wafer is aligned with reference to the orientation flat or V-notch, and then set by transfer arm onto the peeling table.
D.BG Tape Peeling
Thermo-compression peeling tape is bonded by heat plate within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle.
E.Wafer Storage
The peeling back grinding tape and the peeling tape are placed into a dust box and the wafer is unloaded into a cassette by robotic arm.

RAD-3020F/12 (300mm Fully-Automatic BG Tape Remover)

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Catalog (PDF) Download

  • RAD-3020F/12 (PDF:150KB)
1.Stress on the wafer during peeling is reduced with the new peeling method
Using the latest heat seal peeling method, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafers periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer. Having the new peeling method achieves a more stable peeling.
2.Back grinding tape peeling is performed without any contact with the wafer backside
By using our unique wafer holding table, back grinding tape peeling is performed without any contact with the wafer backside.
3.Adopts backside non-contact wafer handling method
By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially shaped backside used in the manufacturing processes of power devices and TSV.
Options
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
  • Compatible with clean room applications, and suitable for front-end process

RAD-3000F/8 (200mm Fully-Automatic BG Tape Remover)

Catalog (PDF) Download

  • RAD-3000F/8 (PDF:139KB)
1.Ideal tape peeling
This equipment applies the 180-degree tape peeling technique to peel back grinding tape from the wafer, minimizing stress on the wafer.
2.Automatic control of UV intensity and quantity of light
The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light, which also enables stable peeling of UV curable back grinding tape.
Options
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)

RAD-3000m/12R (300mm Semi-Automatic BG Tape Remover)

Catalog (PDF) Download

  • RAD-3000m/12R (PDF:114KB)
1.Compactly designed high performance remover
This equipment is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
  • *The equipment is compatible with both wafer and wafer mounted to ring frame.
2.Easy-to-operate semi-automatic type
Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.
3.Stable removing of BG Tape
Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery, and it is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of thin wafers.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

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