Adwill: Tape and equipment for semiconductor device production.

BG Tape Laminator

RAD-3510F/12 (300mm Fully-Automatic BG Tape Laminator)

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Catalog (PDF) Download

  • RAD-3510F/12 (PDF:148KB)
1.Unique tape lamination format
This laminator is mounted with the very latest TTC* system (patent registered) for preventing bow or damage to ultra-thin wafers. Capable of high precision tension control during tape lamination, the equipment substantially reduces residual stress to thin wafers after back grinding.
2.Use of a multi-joint robotic arm
Features a multi-joint robotic arm (patent application completed) for wafer handling and tape cutting within the laminator. In tape cutting, a high precision cutting surface is obtained through accurate control of cutter angles, with no problems during back grinding.
3.High operability realized
A high degree of operability is realized through improvements in the functions on the dialogue-type touch panel located on the front of the equipment. Each type of lamination condition can be set.
  • *TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment's touch screen.
Options
  • Host communication function
    (communication format: conforms to SECS-I and HSMS/Software: conforms to GEM)
  • Double cassette loading
  • Wafer box loading
  • Wafer ID reader

RAD-3510F/12 Operation Process

A.Wafer Loading, Scanning, and Unloading
Detection occurs by scanning wafers inside the cassette for transport. Based on these results, wafers are retrieved by a multi-axis robotic arm and transported to the alignment section.
B.Wafer Alignment
Taking V-notch or OF (Orientation Flat) as standard, the wafer's outer circumference is centered and the wafer is transported to the mounting table.
C.BG Tape Lamination
Back grinding tape is laminated by a press roller (roll-to-roll method). Low-tension lamination is realized with the latest TTC system.
D.Tape Cutting
Through the control of three-dimensional movement (x, y, θ), the tape is cut by moving the cutter knife along the wafer's outer circumference.
E.Residual Tape Processing
The residual tape left after cutting is wound up into a roll.
F.Wafer Storage
The wafer is unloaded by robotic arm into a cassette.

RAD-3500m/12(300mm Semi-Automatic BG Tape Laminator)

Catalog (PDF) Download

  • RAD-3500m/12 (PDF:145KB)
1.Suitable for thin wafers
TTC system enables back grinding tape to be laminated on the wafer without applying stress. Hence, the laminator can also be used for processing thin wafers.
2.Compactly designed high performance laminator
It is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
3.Easy-to-operate semi-automatic type
Once the wafer is set on the mounting table, the back grinding tape can be automatically laminated and cut with simple control inputs.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

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17th IC PACKAGING TECHNOLOGY EXPO

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