Adwill: Tape and equipment for semiconductor device production.

BG Tape Laminator

RAD-3520F/12(300mmFully-Automatic BG Tape Laminator)

Catalog (PDF) Download

  • RAD-3520F/12 (PDF:887KB)

We have now improved the performance of the top-selling model RAD-3510F/12 and have developed the RAD-3520F/12, which offers better performance and a smaller footprint.

1.Double load ports are standard
2.FOUP opener with wafer mapping function is available as standard feature
3.Approximately 30% smaller footprint compared to conventional models
4.Achieves a high productivity of 70 wafers/hour
Additionally achieves a maximum of 100 wafers/hour with the high speed spec option.
5.Improves wafer processing volume per roll of tape a maximum of 16%
*When the tape is a 100m roll and the wafer size is 300 mm (12 inch) in diameter
6.A wide variety of optional functions are installable
ESD countermeasures, various cleaning functions, automatic cutter exchange etc.
7.CE/KC marking, SEMI S2/S8 compliant
  • Various cleaning functions
  • Automatic cutter exchange function
  • ESD (Electro-Static Discharge) countermeasures etc

RAD-3520F/12 Operation Process

A.Wafer Loading, Scanning, and Unloading
Detection occurs by scanning wafers inside the cassette for transport. Based on these results, wafers are retrieved by a multi-axis robotic arm and transported to the alignment section.
B.Wafer Alignment
Taking V-notch or OF (Orientation Flat) as standard, the wafer's outer circumference is centered and the wafer is transported to the mounting table.
C.BG Tape Lamination
Back grinding tape is laminated by a press roller (roll-to-roll method). Low-tension lamination is realized with the latest TTC system.
D.Tape Cutting
Through the control of three-dimensional movement (x, y, θ), the tape is cut by moving the cutter knife along the wafer's outer circumference.
E.Residual Tape Processing
The residual tape left after cutting is wound up into a roll.
F.Wafer Storage
The wafer is unloaded by robotic arm into a cassette.

RAD-3500m/12(300mm Semi-Automatic BG Tape Laminator)

Catalog (PDF) Download

  • RAD-3500m/12 (PDF:145KB)
1.Suitable for thin wafers
TTC system enables back grinding tape to be laminated on the wafer without applying stress. Hence, the laminator can also be used for processing thin wafers.
2.Compactly designed high performance laminator
It is suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
3.Easy-to-operate semi-automatic type
Once the wafer is set on the mounting table, the back grinding tape can be automatically laminated and cut with simple control inputs.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

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