This line-up consists of an abundant array of products that substantially contribute to improved workability and the stabilization of quality for back grinding in the semiconductor fabrication process. Products include BG Tape/Peeling Tape for preventing damage on wafer circuit surfaces during back grinding, a BG Tape Laminator for automatically mounting surface protective tape, and a BG Tape Remover for automatically removing surface protective tape from wafers after back grinding.
Back Grinding Tape(Video Clips)
BG Tape
Two types of back grinding tape are available: UV curable type, “E series,” which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type, “P series.” The peeling tape, “S series,” is also available.
BG Tape Laminator
This is an advanced back grinding tape laminator for thin wafers that achieves tension-free lamination. The line-up consists of two product types that vary in accordance with fully-automatic or semi-automatic functions.
BG Tape Remover
This is an advanced back grinding tape remover that peels tape with a minimal stress on wafer. The line-up consists of four product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.
Carrier Exchanger
This is a fully-automatic wafer transfer equipment that performs packing and unpacking of wafers between coin stack (shipping box) and wafer cassette.
Our exhibit information at SEMICON Japan 2011
