Adwill: Tape and equipment for semiconductor device production.

Products for Back Grinding Process

This line-up consists of an abundant array of products that substantially contribute to improved workability and the stabilization of quality for back grinding in the semiconductor fabrication process. Products include BG Tape/Peeling Tape for preventing damage on wafer circuit surfaces during back grinding, a BG Tape Laminator for automatically mounting surface protective tape, and a BG Tape Remover for automatically removing surface protective tape from wafers after back grinding.

BG Tape

Two types of back grinding tape are available: UV curable type, E series, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type, P series. The peeling tape, S series, is also available.

BG Tape Laminator

This is an advanced back grinding tape laminator for thin wafers that achieves tension-free lamination. The line-up consists of two product types that vary in accordance with fully-automatic or semi-automatic functions.

BG Tape Remover

This is an advanced back grinding tape remover that peels tape with a minimal stress on wafer. The line-up consists of four product types that vary in accordance with fully-automatic or semi-automatic functions, as well as wafer size.
Products for Back Grinding Process
Products for Dicing/Mounting Process
Products for DBG Process

What is Adwill?

Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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