Adwill: Tape and equipment for semiconductor device production.

Adwill: Leading-edge Materials and System Products

[Adwill = Adhesion Level at Will]

Complete control of tape adhesion. The Lintec Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes. Adwill continues to make steady progress in the advancement of related equipment and unique systems.

Products for Back Grinding Process

BG Tape

UV Curable Non-UV
E series P series

Peeling Tape
S series

BG Tape Laminator

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-3510F/12 RAD-3500m/12

BG Tape Remover

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-3010F/12 RAD-3000m/12R
RAD-3020F/12
8" RAD-3000F/8 -

Products for Dicing/Mounting Process

Dicing Tape

UV Curable Non-UV
D series G series

Dicing Die Bonding Tape
LE Tape

Die to Substrate Application Die to Die Application Die to Die FOW Application

LD Tape

Wafer Mounter

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-2510F/12Sa RAD-2500m/12
RAD-2512F/12
8" RAD-2500F/8 RAD-2500m/8

UV Irradiation System

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-2010F/12 RAD-2100m/12
RAD-2010m/12
8" RAD-2000F/8 RAD-2000m/8

LC Tape Laminator

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-3600F/12 -

Pressurized Curing System
RAD-9100-450
RAD-9100-050

Barcode & Vision System

Wafer Fully-
Automatic
Semi-
Automatic
12" RAD-5000VS12 -

Products for DBG Process

What is Adwill?

Exhibition Information

17th IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.

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