Adwill: Tape and equipment for semiconductor device production.

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  • Products for Back Grinding Process
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Topics

  • ExhibitionWe will exhibit SEMICON Southeast Asia 2016
    Dates: Apr. 26(Tue.) 28(Thu.) Venue: SPICE Arena Penang
  • ExhibitionWe will exhibit SEMICON China 2016
    Dates: Mar. 15(Tue.) 17(Thu.) Venue: Shanghai New International Expo Centre
  • ExhibitionWe exhibited 17th IC PACKAGING TECHNOLOGY EXPO
    Dates: Sep. 17(Thu.) 19(Sat.) Venue: Hanoi International Center
  • ExhibitionWe exhibited NEPCON Vietnam 2015
    Dates: Sep. 17(Thu.) 19(Sat.) Venue: Hanoi International Center
Exhibition Information

IC PACKAGING TECHNOLOGY EXPO

LINTEC's 17th IC PACKAGING TECHNOLOGY EXPO exhibit information is available.